Display panels

ABSTRACT

A display panel comprising a substrate, signal lines, bonding pads, connecting leads, and capacitance compensating devices. The signal lines are disposed on the substrate. The bonding pads are disposed in a bonding area on the substrate and connected to a driver. The connecting leads are arranged in a fan configuration. Lengths of the connecting leads gradually decrease from the outside to the inside of the fan configuration. Each connecting lead is connected between the bonding pad and the signal line and has a compensating section, and lengths of the compensating sections are equal. Each capacitance compensating device is coupled to the compensating section of the corresponding connecting lead. The compensating values of the capacitance compensating devices gradually increase from the outside to the inside of the fan configuration.

BACKGROUND

The invention relates to a display panel, and in particular to a displaypanel compensating RC delay in signal lines.

Typically, a display panel of a conventional liquid crystal display(LCD) device comprises a plurality of scan lines and a plurality of datalines. The scan lines are interlaced with the data lines to form anactive area. A plurality of pixel electrodes and a plurality of thinfilm diodes or thin film transistors are formed in the active area. Ascan driver and a data driver respectively provide scan signals and datasignals to the scan lines and the data lines through a plurality ofbonding pads. The bonding pads are assembled to form bonding areas. Eachbonding area is typically connected to a fanout area having a pluralityof leads to connect the scan lines and data lines respectively to thescan driver and data driver.

FIG. 1 is a display panel of a conventional LCD device. A display panel1 comprises a plurality of scan lines GL and a plurality of data linesDL. The scan lines GL are interlaced with the data lines DL in an activearea 11. A plurality of bonding pads are formed in a plurality ofbonding areas 12 near the periphery of the active area 11. In order toconnect the scan lines GL and data lines DL to the bonding pads in thebonding areas 12, a plurality of fanout areas 13 are formed between thebonding areas 12 and the active area 11. Each fanout area 13 comprises aplurality of leads 14 connecting the scan lines GL and data lines DL tothe corresponding bonding pads. Referring to FIG. 1, in each fanout area13, the distances between the leads 14 gradually decrease from theactive area 11 to the bonding area 12. Thus, in each fanout area 13, thelengths of the leads 14 gradually decrease from the outside to theinside of the fanout area 13, so that the resistance (R) and the coupledcapacitance (C) gradually decrease from the outside to the insidethereof, resulting in different RC delays between the leads 14. Thedifference in RC delays causes degraded image qualities, such asundesirable mura defects.

SUMMARY

An exemplary embodiment of a display panel comprises a substrate, aplurality of signal lines, a plurality of bonding pads, a plurality ofconnecting leads, and a plurality of capacitance compensating devices.The substrate has a bonding area. The signal lines are disposed on thesubstrate. The bonding pads are disposed in the bonding area andconnected to a driver. The connecting leads are arranged in a fanconfiguration. Lengths of the connecting leads gradually decrease fromthe outside to the inside of the fan configuration. Each connecting leadis connected between the bonding pad and the signal line and has acompensating section, and lengths of the compensating sections areequal. Each capacitance compensating device is coupled to thecompensating section of the corresponding connecting lead. Thecompensating values of the capacitance compensating devices graduallyincrease from the outside to the inside of the fan configuration.

An exemplary embodiment of a display panel comprises a substrate, aplurality of signal lines, a driver, a plurality of bonding pads, and aplurality of connecting leads. The substrate has a bonding area. Thesignal lines are disposed on the substrate. The driver comprises anoutput circuit for outputting a plurality of signals. The bonding padsare disposed in the bonding area and connected to the output circuit.Each connecting lead is connected between the bonding pad and the signalline. The driver further comprises a compensating device providingresistance and/or capacitance compensation to the signals.

DESCRIPTION OF THE DRAWINGS

The invention will become more fully understood from the detaileddescription given hereinbelow and the accompanying drawings, given byway of illustration only and thus not intended to be limitative of theinvention.

FIG. 1 shows a display panel of a conventional LCD device.

FIG. 2 shows an embodiment of a display panel.

FIG. 3 is a detailed diagram of the connecting leads in FIG. 2.

FIG. 4 shows an embodiment of an embodiment of a display panel.

FIG. 5 shows a detailed diagram of the connecting leads in FIG. 4.

FIG. 6 shows an embodiment of a display panel.

FIG. 7 shows an example of the widths of the first, second, and thirdsections of the connecting leads in FIG. 6.

FIGS. 8 and 9 show examples of the lengths of the first, second, andthird sections of the connecting leads in FIG. 6.

FIGS. 10 a-10 c show examples of the shapes of the first and secondsections of the connecting leads in FIG. 6.

FIG. 11 shows the capacitance compensating devices coupled to the secondsections in FIG. 6.

FIG. 12 shows an embodiment of an embodiment of a display panel.

FIGS. 13 a-13 c show examples of the compensating devices of the driversin FIG. 12.

DETAILED DESCRIPTION

In an exemplary embodiment of a display panel shown in FIG. 2, a displaypanel 2 comprises an active area 21 formed by interlaced signal lines.As shown in FIG. 2, a plurality of scan lines GL and a plurality of datalines DL are disposed in a substrate 27 and interlaced to form theactive area 21. A plurality of bonding areas 22 are formed near theperiphery of the active area 21 and connected to a scan driver 25 and adata driver 26. A plurality of bonding pads are disposed in each bondingarea 22. In order to provide signals to the scan lines GL and data linesDL from the scan driver 25 and data driver 26, a plurality of connectingleads 23 are formed between the bonding areas 22 and the active area 21.Each connecting leads 23 is connected between one signal line and thecorresponding bonding pad. For each bonding area 22, the correspondingconnecting leads 23 are arranged in a fan configuration, and the lengthsof the connecting leads 23 gradually decrease from the outside to theinside of the fan configuration, so that the resistance (R) and thecoupled capacitance (C) gradually decreases from the outside to theinside thereof. Each connecting lead 23 has a compensating section 23′,and the lengths of the compensating sections 23′ are equal. In FIG. 2,the compensating sections 23′ are straight lines. For each bonding area22, capacitance compensating devices 24 are coupled to the compensatingsections 23′, and the compensating values of the capacitancecompensating devices 24 gradually increase from the outside to theinside of the fan configuration.

In following description, the connecting leads 23 between the data linesDL and the bonding area 22 are given as an example. Referring to FIG. 3,there are seven connecting leads 23 ₁ to 23 ₇. One terminal of each ofthe connecting leads 23 ₁ to 23 ₇ is connected to the same bonding area22, and the other terminal thereof is connected to the correspondingdata line DL. The connecting leads 23 ₁ to 23 ₇ respectively havecompensating sections 23′₁ to 23′₇, and the lengths of the compensatingsections 23′₁ to 23′₇ are equal. The capacitance compensating devices 24₁ to 24 ₇ are respectively coupled to the compensating sections 23′₁ to23′₇. The compensating values of the capacitance compensating devices 24₁ to 24 ₇ gradually increase from the outside to the inside of the fanconfiguration. The coupled capacitance (C) of the connecting leads 23 ₁to 23 ₇ is adjusted by the compensating values of the capacitancecompensating devices 24 ₁ to 24 ₇, degrading the difference between theRC delays of the connecting leads 23 ₁ to 23 ₇.

Referring to FIG. 3, the lengths of the compensating sections 23′₁ to23′₇ are equal, and the compensating sections 23′₁ to 23′₇ are formed bythe corresponding parts of the connecting leads 23 ₁ to 23 ₇ and haveserpentine shapes. The capacitance compensating devices 24 ₁ to 24 ₇ areformed by conductors coupled in series. As shown in FIG. 3, the areas ofthe regions in which the conductors are coupled to the compensatingsections 23′₁ to 23′₇ gradually increase from the outside to the insideof the fan configuration, thus, the compensating values of thecapacitance compensating devices 24 ₁ to 24 ₇ gradually increase fromthe outside to the inside thereof.

In an exemplary embodiment of a display panel in FIG. 4, a display panel4 comprises an active area 21 formed by interlaced signal lines. Asshown in FIG. 4, a plurality of scan lines GL and a plurality of datalines DL are disposed in a substrate 47 and interlaced to form theactive area 41. A plurality of bonding areas 42 are formed near theperiphery of the active area 41 and connected to a scan driver 45 and adata driver 46. A plurality of bonding pads are gathered in each bondingarea 42. In order to provide signals to the scan lines GL and data linesDL from the scan driver 45 and data driver 46, a plurality of connectingleads 43 are formed between the bonding areas 42 and the active area 41.Each connecting lead 43 is connected between one signal line and thecorresponding bonding pad. For each bonding area 42, the correspondingconnecting leads 43 are arranged in a fan configuration. Each connectinglead 43 has a compensating section 43′. The lengths of compensatingsections 43′ gradually increase from the outside to the inside of thefan configuration, so that the resistance of the connecting leads 43 iscompensated. A plurality of capacitance compensating devices 44 arecoupled to the compensating sections 43′, and the compensating values ofthe capacitance compensating devices 44 gradually increase from theoutside to the inside of the fan configuration, thus, the capacitance ofthe connecting leads 43 is compensated.

In followed description, the connecting leads 43 between the data linesDL and the bonding area 42 are given as an example. Referring to FIG. 5,one terminal of each of the connecting leads 43 ₁ to 43 ₇ is connectedto the same bonding area 42, and the other terminal thereof is connectedto the corresponding data line DL. The connecting leads 43 ₁ to 43 ₇respectively have compensating sections 43′₁ to 43′₇, and the lengths ofthe compensating sections 43′₁ to 43′₇ gradually increase from theoutside to the inside of the fan configuration. The capacitancecompensating devices 44 ₁ to 44 ₇ are respectively coupled to thecompensating sections 43′₁ to 43′₇. The compensating values of thecapacitance compensating devices 44 ₁ to 44 ₇ gradually increase fromthe outside to the inside of the fan configuration. The resistance (R)and the coupled capacitance (C) of the connecting leads 43 ₁ to 43 ₇ areadjusted by the lengths of the compensating sections 43′₁ to 43′₇ andthe compensating values of the capacitance compensating devices 44 ₁ to44 ₇, degrading the difference between the RC delays of the connectingleads 43 ₁ to 43 ₇. As described above, the compensating values of thecapacitance compensating devices 44 ₁ to 44 ₇ and the lengths of thecompensating sections 43′₁ to 43′₇ are in direct proportion.

Referring to FIG. 5, the lengths of the compensating sections 43′₁ to43′₇ gradually increase from the outside to the inside of the fanconfiguration, and the compensating sections 43′₁ to 43′₇ are formed bythe corresponding parts of the connecting leads 43 ₁ to 43 ₇ and haveserpentine shapes. The capacitance compensating devices 44 ₁ to 44 ₇ areformed by conductors coupled in series. As shown in FIG. 5, the areas ofregions in which the conductors are coupled to the compensating sections43′₁ to 43′₇ gradually increase from the outside to the inside of thefan configuration, thus, the compensating values of the capacitancecompensating devices 44 ₁ to 44 ₇ gradually increase from the outside tothe inside thereof. In other words, the lengths of the compensatingsections 43′₁ to 43′₇ and the areas of the regions in which theconductors are coupled to the compensating sections 43′₁ to 43′₇ indirect proportion.

In an exemplary embodiment of a display panel in FIG. 6, a display panel6 comprises an active area 61 formed by interlaced signal lines. Asshown in FIG. 6, a plurality of scan lines GL and a plurality of datalines DL are disposed in a substrate 67 and interlaced to form theactive area 61. A plurality of bonding areas 62 are formed near theperiphery of the active area 61 and connected to a scan driver 65 and adata driver 66. A plurality of bonding pads are gathered in each bondingarea 62. In order to provide signals to the scan lines GL and data linesDL from the scan driver 65 and data driver 66, a plurality of connectingleads 63 are formed between the bonding areas 62 and the active area 61.Each connecting lead 63 is connected between one signal line and thecorresponding bonding pad. For each bonding area 62, the correspondingconnecting leads 63 are arranged in a fan configuration. Each connectinglead 43 comprises three sections.

In following description, the connecting leads 63 between the data linesDL and the bonding area 62 are given as an example. Referring to FIG. 7,each of the connecting leads 63 ₁ to 63 ₇ comprises a first section S₁,a second section S₂, and a third section S₃. The widths of the firstsections S₁ of the connecting leads 63 ₁ to 63 ₇ are equal, the widthsof the second sections S₂ thereof are equal, and the widths of the thirdsections S₃ thereof are equal. For each connecting lead, such as theconnecting leads 63 ₁, the first section S₁ is connected to the bondingpad of the corresponding bonding area 62, the second section S₂ isconnected to the corresponding data line, and the third section S₃ isconnected between the first section S₁ and the second section S₂. In theembodiment of FIG. 7, the width of the third section S₃ is differentfrom the widths of the first section S₁ and the second section S₂.Moreover, the widths of the first section S₁ and the second section S₂are equal, and the widths thereof are less than the width of the thirdsection S₃. In other embodiments, the widths of the first section S₁ andthe second section S₂ can be unequal.

In the embodiment of FIG. 8, the lengths of the first sections S₁gradually increase from the outside to the inside of the fanconfiguration, and the lengths of the third sections S₃ graduallydecrease from the outside to the inside thereof. The lengths of thesecond sections S₂ are equal in the embodiment of FIG. 8. The lengths ofthe second sections S₂ gradually increase from the outside to the insideof the fan configuration in the embodiment of FIG. 9.

The first sections S₁ and the second sections S₂ have various shapes.Referring to FIG. 10 a, the first sections S₁ and the second sections S₂can have serpentine shapes. Referring to FIG. 10 b, the first sectionsS₁ and the second sections S₂ can have a saw-tooth profile. Referring toFIG. 10 c, the first sections S₁ and the second sections S₂ can havewavelike shapes. Accordingly, the resistance (R) of the connecting lead63 ₁ to 63 ₇ is adjusted by varying the lengths and widths of thesections S₁ , S₂, and S₃.

Referring to FIG. 11, capacitance compensating devices 110 ₁ to 110 ₇coupled in series are respectively coupled to second sections S₂ of theconnecting leads 63 ₁ to 63 ₇. The compensating values of thecapacitance compensating devices 110 ₁ to 110 ₇ and the lengths of thecorresponding second sections S₂ are in direct proportion. In FIG. 11,the lengths of the second sections S₂ gradually increase from theoutside to the inside of the fan configuration, and the compensationvalues of the capacitance compensating devices 110 ₁ to 110 ₇ alsogradually increase from the outside to the inside thereof. Thecapacitance compensating devices 110 ₁ to 110 ₇ are formed by conductorscoupled in series. Referring to FIG. 11, the areas of regions in whichthe conductors are coupled to the compensating sections 43′₁ to 43′₇gradually increase from the outside to the inside of the fanconfiguration, so that the compensation values of the capacitancecompensating devices 110 ₁ to 110 ₇ gradually increase from the outsideto the inside thereof.

Thus, the resistance (R) and the coupled capacitance (C) of theconnecting lead 63 ₁ to 63 ₇ are adjusted by varying the lengths andwidths of the sections S₁, S₂, and S₃ and the compensation values of thecapacitance compensating devices 110 ₁ to 110 ₇, degrading thedifference between the RC delays of the connecting leads 63 ₁ to 63 ₇.

In an exemplary embodiment of a display panel in FIG. 11, RC delays canbe compensated by compensating devices of a scan driver and a datadriver. Referring to FIG. 11, a display panel 120 comprises an activearea 121 formed by interlaced signal lines. As shown in FIG. 11, aplurality of scan lines GL and a plurality of data lines DL are disposedin a substrate 127 and interlaced to form the active area 61. Aplurality of bonding areas 162 are formed near the periphery of theactive area 121 and connected to a scan driver 125 and a data driver126. A plurality of bonding pads are gathered in each bonding area 122.In order to provide signals to the scan lines GL and data lines DL fromthe scan driver 125 and data driver 126, a plurality of connecting leads123 are formed between the bonding areas 122 and the active area 121.Each connecting leads 123 is connected between one signal line and thecorresponding bonding pad. For each bonding area 122, the correspondingconnecting leads 123 are arranged in a fan configuration, and thelengths of the connecting leads 123 gradually decrease from the outsideto the inside of the fan configuration, so that the resistance (R) andthe coupled capacitance (C) gradually decrease from the outside to theinside thereof.

Both scan driver 125 and data driver 126 comprise output circuits 125 aand 126 a. In the following description, the data driver 126 is given asan example. The output circuit 126 a of the data driver 126 outputs datasignals to the connecting leads 123. The data driver 126 furthercomprises a compensating device 126 b providing resistance (R) and/orcapacitance (C) to the connecting leads 123, so that the unequal RCdelays of the data signals can be compensated. In the embodiment of FIG.13 a, the compensating device 126 b only provides resistance (R). In theembodiment of FIG. 13 b, the compensating device 126 b only providescapacitance (C). In the embodiment of FIG. 13 c, the compensating device126 b provides resistance (R) and capacitance (C). Similarly, the scandriver 125 further comprises a compensating device 125 b providingresistance (R) and/or capacitance (C) to the connecting leads 123, sothat the unequal RC delays of scan signals can be compensated.

In the embodiment of FIG. 11, the unequal RC delays can further becompensated by varying the lengths and widths of the connecting leads123. For example, the widths of the connecting leads 123 graduallyincrease from the outside to the inside of the fan configuration.

While the invention has been described in terms of preferred embodiment,it is to be understood that the invention is not limited thereto. On thecontrary, it is intended to cover various modifications and similararrangements as would be apparent to those skilled in the art.Therefore, the scope of the appended claims should be accorded thebroadest interpretation so as to encompass all such modifications andsimilar arrangements.

1. A display panel comprising: a substrate having a bonding area; aplurality of signal lines disposed on the substrate; a plurality ofbonding pads disposed in the bonding area and connected to a driver; aplurality of connecting leads arranged in a fan configuration, whereinlengths of the connecting leads gradually decrease from the outside tothe inside of the fan configuration, each connecting lead is connectedbetween the bonding pad and the signal line and has a compensatingsection, and lengths of the compensating sections are equal; and aplurality of capacitance compensating devices, each coupled to thecompensating section of the corresponding connecting lead, wherein thecompensating values of the capacitance compensating devices graduallyincrease from the outside to the inside of the fan configuration.
 2. Thedisplay panel as claimed in claim 1, wherein each compensating sectionis formed by one part of the corresponding connecting lead and have aserpentine shape.
 3. The display panel as claimed in claim 2, whereinthe capacitance compensating devices are formed by a plurality ofconductors coupled in series.
 4. The display panel as claimed in claim3, wherein the areas of regions in which the conductors are coupled tothe compensating sections gradually increase from the outside to theinside of the fan configuration.
 5. A display panel comprising: asubstrate having a bonding area; a plurality of signal lines disposed onthe substrate; a plurality of bonding pads disposed in the bonding areaand connected to a driver; a plurality of connecting leads arranged in afan configuration, wherein each connecting lead is connected between thebonding pad and the signal line and has a compensating section, andlengths of the compensating sections gradually increase from the outsideto the inside of the fan configuration; and a plurality of capacitancecompensating devices, each coupled to the compensating section of theconnecting lead, wherein the compensating values of the capacitancecompensating devices and the lengths of the compensating sections of thecorresponding connecting leads are in direct proportion.
 6. The displaypanel as claimed in claim 5, wherein each compensating section is formedby one part of the corresponding connecting lead and have a serpentineshape.
 7. The display panel as claimed in claim 6, wherein thecapacitance compensating devices are formed by a plurality of conductorscoupled in series.
 8. The display panel as claimed in claim 7, whereinthe areas of regions in which the conductors are coupled to thecompensating sections and the lengths of the compensating sections arein direct proportion.
 9. A display panel comprising: a substrate havinga bonding area; a plurality of signal lines disposed on the substrate; aplurality of bonding pads disposed in the bonding area and connected toa driver; and a plurality of connecting leads arranged in a fanconfiguration, wherein each connecting lead is connected between thebonding pad and the signal line and has a first, second, and thirdsections; wherein widths of the first sections of the connecting leadsare equal, widths of the second sections thereof are equal, and widthsof the third sections thereof are equal; and wherein the widths of thethird sections are unequal to the widths of the first sections andwidths of the second sections.
 10. The display panel as claimed in claim9, wherein the widths of the first sections are unequal to the widths ofthe second sections.
 11. The display panel as claimed in claim 9,wherein the widths of the first sections are equal to the widths of thesecond sections, and the widths of first sections and widths of thesecond sections are less than the widths of the third sections.
 12. Thedisplay panel as claimed in claim 9, wherein for each connecting lead,the first section is connected to the corresponding bonding pad, thesecond section is connected to the corresponding signal line, and thethird section is connected between the first and second sections. 13.The display panel as claimed in claim 12, wherein lengths of the firstsections gradually increase from the outside to the inside of the fanconfiguration, and lengths of the third sections gradually decrease fromthe outside to the inside of the fan configuration.
 14. The displaypanel as claimed in claim 13, wherein lengths of the second sections areequal.
 15. The display panel as claimed in claim 13, wherein lengths ofthe second sections gradually increase from the outside to the inside ofthe fan configuration.
 16. The display panel as claimed in claim 12further comprising a plurality of capacitance compensating devicescoupled in series, each coupled to the second section of thecorresponding connecting lead, wherein the compensating values of thecapacitance compensating devices and lengths of the second sections arein direct proportion.
 17. The display panel as claimed in claim 16,wherein the capacitance compensating devices are formed by a pluralityof conductors which are coupled in series and corresponding to thesecond sections.
 18. The display panel as claimed in claim 17, whereinthe areas of regions in which the conductors are coupled to the secondsections and the lengths of the second sections are in directproportion.
 19. The display panel as claimed in claim 17, wherein theareas of regions in which the conductors are coupled to the secondsections gradually increase from the outside to the inside of the fanconfiguration.
 20. The display panel as claimed in claim 9, wherein thefirst sections and the second sections have a saw-tooth profile.
 21. Thedisplay panel as claimed in claim 9, wherein the first sections and thesecond sections have edges of sharp teeth of a saw.
 22. The displaypanel as claimed in claim 9, wherein the first sections and the secondsections have serpentine shapes.
 23. A display panel comprising: asubstrate having a bonding area; a plurality of signal lines disposed onthe substrate; a driver comprising an output circuit for outputting aplurality of signals; a plurality of bonding pads disposed in thebonding area and connected to the output circuit; and a plurality ofconnecting leads, each connected between the bonding pad and the signalline; wherein the driver further comprises a compensating deviceproviding resistance and/or capacitance compensation to the signals. 24.The display panel as claimed in claim 23, wherein the connecting leadsare arranged in a fan configuration.
 25. The display panel as claimed inclaim 24, wherein lengths of the connecting leads gradually decreasefrom the outside to the inside of the fan configuration.
 26. The displaypanel as claimed in claim 24, wherein widths of the connecting leadsgradually increase from the outside to the inside of the fanconfiguration.